Today, a brand-new Ryzen 9 7945HX3D CPU by AMD for mobile devices has been unveiled. This is being hailed by the manufacturer as the “new ultimate mobile gaming processor” that will eventually be used in high-end products.
Let’s get into the specifications about the device.
The Ryzen 9 7945HX3D has 16 cores, 32 threads, and a maximum boost frequency of 5.4GHz. It has 144MB of 3D V-Cache and a 55+W TDP.
AMD has now successfully incorporated a 3D V-Cache technology onto its mobile CPU for the first time.
This technology offers 200x and 15x greater interconnect density than an on-package 2D chipset and micro Bump 3D, respectively, as well as 3x higher interconnect energy efficiency for the latter.
According to AMD, the Ryzen 9 7945HX3D is generally 15% faster than the Ryzen 7945HX. When compared to a 3D V-Cache that is disabled, its performance on Shadow of the Tomb Raider (1080P high settings) can increase by up to 23% in 40W TDP. The Zen4 CCD design serves as the foundation for 3D chiplet technology.
The ROG Strix SCAR 17 will get the Ryzen 9 7945HX3D first, which is scheduled for 22 August 2023. This CPU is expected to debut in the US before entering the Malaysian market.
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