IIZMO shares hit 20 upper circuit today after its semiconductor arm, izmomicro, announced a major milestone in silicon photonics packaging—an achievement that underscores its pioneering role in India’s growing semiconductor ecosystem and strengthens the country’s position in the global race toward advanced AI and data infrastructure.
The company has successfully developed a high-density silicon photonics packaging platform capable of supporting 32-channel fiber input and output with an industry-leading insertion loss of less than 2 dB. Reaching this level of density is considered one of the toughest challenges in the field, requiring nanometer-scale optical alignment, sophisticated assembly processes, and seamless electronic-photonic integration.
Beyond fiber I/O, the module also incorporates 32 DC I/Os, 4 RF I/Os, and high-speed RF performance up to 70 GHz—a new benchmark in the integration of photonic and electronic systems.
This achievement reflects izmomicro’s sustained investments in cutting-edge R&D and years of expertise in semiconductor packaging technologies. By solving the critical bottleneck of density and precision in silicon photonics, the company has placed itself among a select group of global players capable of delivering such advanced capabilities.
The significance of this development goes far beyond hardware. As traditional copper interconnects near their physical limits, silicon photonics has emerged as a key enabler of multi-terabit optical communication—a foundation for the future of AI, hyperscale cloud computing, and next-generation 5G/6G networks.
By breaking through packaging constraints, izmomicro is helping unlock the scalability, efficiency, and speed required for AI clusters, hyperscale data centers, and global telecommunications infrastructure.
