HCLTech, a global leader in technology and engineering services, has been selected as a Design Solution Partner (DSP) under the Samsung Advanced Foundry Ecosystem (SAFE™) program. This strategic collaboration aims to accelerate semiconductor development by leveraging HCLTech’s expertise in Engineering and R&D services.
Through this partnership, HCLTech will provide application-specific integrated circuit (ASIC) design services to semiconductor companies utilizing Samsung’s cutting-edge process technologies. The collaboration strengthens HCLTech’s position in the semiconductor industry, enabling it to support clients in developing next-generation silicon solutions.
As part of the SAFE™-DSP program, Samsung will offer specialized training to HCLTech engineers, ensuring they stay at the forefront of semiconductor advancements. Additionally, Samsung will provide technical support on turnkey projects and enhance wafer access through Multi-Project Wafer (MPW) programs, streamlining prototyping and production.
With a strong presence in India and deep expertise in System-on-Chip (SoC) platforms and IP partnerships, HCLTech is well-positioned to drive innovation in semiconductor design. This collaboration underscores the shared commitment of both companies to accelerating the time-to-market for new silicon technologies.
Taejoong Song, Vice President and head of the Technology Planning 2 Team at Samsung Electronics, highlighted the significance of this partnership in fostering technological excellence. By combining HCLTech’s engineering capabilities with Samsung’s advanced manufacturing processes, the alliance is set to deliver cutting-edge semiconductor solutions.
