IoT | Business Upturn

India’s ‘Sangam: Digital Twin’ initiative aims for technological transformation

Tushar Aggarwal — Sun, 10 Mar 2024 06:56:06 +0000

The ‘Sangam: Digital Twin’ initiative, spearheaded by the Department of Telecommunications (DoT) in India, aims to propel the country towards becoming the most developed nation by 2047. This ambitious initiative, inspired by Prime Minister Narendra Modi’s vision for futuristic infrastructure, seeks to revolutionize infrastructure planning and design by leveraging cutting-edge technologies.

Telecom Secretary Dr. Neeraj Mittal highlighted the initiative’s goal of breaking down silos in planning across ministries, emphasizing collaboration and innovation. The initiative harnesses the power of 5G, IoT, AI, AR/VR, AI-native 6G, ‘Digital Twin,’ and next-generation computational technologies to reshape infrastructure planning and design.

B. V. R. Subrahmanyam, CEO of NITI Aayog, underscored the transformative potential of Digital Twin technology. He discussed the role of AI in shaping the future landscape and expressed optimism about India’s position at the forefront of technological advancements.

The ‘Sangam: Digital Twin’ initiative is poised to usher in a new era of digital empowerment and technological advancements in India. It aims to leverage unified data and collective intelligence to anticipate the real-world effects of innovative infrastructure planning solutions. This approach will help formulate a future roadmap for sustainable and scalable development of infrastructure projects.

Prof. Debabrata Das, Director of IIIT Bengaluru, highlighted the alignment of the initiative with ongoing research in 6G, advanced telecommunications, IoT, Digital Twin, AI, ML, and other cutting-edge areas. This indicates a comprehensive and forward-thinking approach towards infrastructure development in India.

Overall, the ‘Sangam: Digital Twin’ initiative represents a significant step towards realizing India’s vision of becoming a global leader in technological innovation and development. By harnessing the power of digital technologies, India is poised to transform its infrastructure landscape and achieve unprecedented levels of growth and development.

Revolutionizing Sensing Technology: The Rise of Printed Sensors

Tushar Aggarwal — Tue, 27 Feb 2024 09:17:31 +0000

In recent years, printed sensors have emerged as a groundbreaking technology, offering flexible, cost-effective sensing solutions with wide-ranging applications across industries. These sensors, which can withstand mechanical deformation without damage, are revolutionizing the way industries approach sensing and monitoring.

Printed sensors utilize inkjet printing and related technologies to integrate sensing components into substrates like textiles, paper, foil, or plastic. This advancement has opened up new possibilities for wearable technologies, health monitoring, and environmental sensing, among other applications.

One of the key advantages of printed sensors is their cost-efficient production. Compared to traditional sensors, printed sensors can be manufactured at a lower cost, making them more accessible for a wide range of applications. Additionally, their flexibility allows for large-area sensing capabilities, fast response times, and the ability to withstand mechanical deformation without damage.

The applications of printed sensors are vast and diverse. In the life sciences, printed biosensors are used for monitoring and controlling gas mixtures, detecting toxic substances, and conducting medical diagnostics. In the automotive industry, printed sensors are used for pressure monitoring and control in tires and engine components.

In the energy sector, printed sensors are used for monitoring and controlling temperature in industrial machines and smart textiles. In aviation, printed sensors are used for strain gauges to monitor stress in aircraft components. In electronics, printed sensors are used for touch sensors, humidity sensors, gas sensors, and chemical sensors.

Companies like e2ip technologies, Thin Film, and Tekscan have successfully implemented printed sensors in various applications. e2ip technologies produce screen-printed electrodes for medical devices, Thin Film uses printed sensors for package tracking, and Tekscan develops flexible force sensors for industries like manufacturing.

Looking ahead, the future of printed sensors looks bright. The market for printed and flexible sensors is expected to grow significantly, driven by increased demand for wearable technologies, consumer electronics, and environmental monitoring. Technological advances in additive manufacturing and printing will further accelerate market growth, making printed sensors a key technology in the Industry 4.0 landscape.

Arqit and CableFree launch World’s first Quantum-Safe 5G cellular technology Products

Tushar Aggarwal — Thu, 22 Feb 2024 12:18:18 +0000

Arqit and CableFree have collaborated to introduce the world’s first quantum-safe 5G cellular technology products. Arqit, a leader in quantum-safe encryption, and CableFree: Wireless Excellence Ltd (CableFree), known for its 5G Radio solutions, have combined their expertise to offer integrated quantum-safe cellular technology products for Private 5G networks using Symmetric Key Agreement.

Private 5G networks based on 5G cellular technology are driving digital transformation across various industries, including manufacturing, healthcare, defense, and smart cities. These networks provide enterprises with high-speed, scalable, and reliable wireless connectivity, enabling them to implement innovative IoT and mobile solutions that enhance productivity, drive automation, and improve customer engagement.

Ensuring the security of these networks is crucial as they support safety-critical infrastructure and handle highly sensitive data. With the expansion of the attack surface due to 5G networks and direct-to-device connectivity, cyber adversaries can launch attacks on a broader scale and at faster speeds.

The integration of CableFree’s 5G Small Cell Radios with Arqit’s Symmetric Key Agreement encryption technology enhances the security of Private 5G networks. These products, now available worldwide, leverage a zero-trust architecture and deliver rotating authentication, rendering data harvesting ineffective.

David Williams, Arqit Founder, Chairman, and CEO, highlighted the significance of symmetric key agreement in securing classified networking, particularly with the mandate from the USA’s National Information Assurance Partnership (NIAP) to support RFC 8784. He emphasized the need for the telecoms industry to secure sensitive data against current and future cyber threats, including spoofing attacks and quantum computing.

Stephen Patrick, CableFree Founder, and CEO expressed excitement about extending the CableFree 5G range to include Arqit’s quantum-safe encryption technology. This technology can be deployed as a software extension on CableFree’s 5G radios, providing enhanced security for customers worldwide.

The integration of Arqit’s encryption technology with CableFree’s 5G solutions represents a significant advancement in securing Private 5G networks. By combining quantum-safe encryption with 5G technology, Arqit and CableFree are paving the way for a more secure and resilient wireless communication infrastructure.

The collaboration between Arqit and CableFree has resulted in a groundbreaking development in the field of 5G cellular technology. Their integrated products offer enhanced security for Private 5G networks, addressing the growing need for secure and reliable wireless connectivity in various industries.

eSIM Technology revolutionizing cellular IoT market, Says Omdia research

Tushar Aggarwal — Thu, 15 Feb 2024 16:53:49 +0000

The advent of embedded SIM (eSIM) technology is reshaping the landscape of the cellular Internet of Things (IoT) market, offering enterprises newfound efficiency and flexibility. A recent study by Omdia underscores the transformative potential of eSIMs, particularly in simplifying device management, expanding network coverage, and enhancing commercial terms for businesses.

eSIM technology has gained momentum, fueled by the GSMA SGP.31/32 specifications, which have paved the way for widespread adoption, especially in Low Power Wide Area Network (LPWAN) devices. By streamlining the process of switching between network profiles, eSIMs empower enterprises to manage their devices more effectively, access broader network coverage, and negotiate more favorable commercial agreements.

While eSIMs have already found success in consumer markets, particularly in premium smartphones and smartwatches, the complexities of power, computing, and end-user intervention have hindered their full potential in the IoT space. However, Omdia’s research indicates that these barriers are gradually being overcome as innovative solutions enter the market. This progress is expected to drive the adoption of eSIM technology in the IoT sector from just over 1 billion devices in 2023 to over 3.6 billion by 2030.

Several key trends are propelling the growth of the eSIM market in IoT, including advancements in eSIM technology itself, as well as the broader adoption of IoT facilitated by technologies such as 5G RedCap, 5G Massive IoT, and 4G LTE Cat-1bis modules, in addition to increased demand from enterprises.

John Canali, IoT Principal Analyst at Omdia, highlighted the significance of eSIM technology for IoT devices, noting, “This will create greater competition between communication service providers (CSPs), as IoT enterprises are less subjected to vendor lock-in by the CSPs and are better positioned to renegotiate connectivity tariffs.”

Andrew Brown, Practice Lead for IoT at Omdia, also emphasized the impact of the new GSMA SGP.32 eSIM specification, designed specifically for IoT. Brown noted, It offers significant advantages in terms of cost, flexibility, and longevity for hardware OEMs, finally beginning to bridge the gap between traditional consumer device provisioning and more traditional IoT devices.

Omdia’s optimistic eSIM forecast is reinforced by primary data collected from a survey of over 700 global IoT enterprises. Nearly 90% of respondents expressed plans to adopt eSIM/iSIM technology within the next two years. Beyond the enhanced security that eSIMs offer, IoT enterprises are attracted to the benefits of creating more reliable networks, managing costs, and easily complying with local regulations.

U.S. and EU forge joint cybersecurity pact for safer IoT products

Eesha Chakraborty — Thu, 15 Feb 2024 15:54:57 +0000

In a significant move towards safeguarding consumer-facing Internet-of-Things (IoT) devices the United States and the European Union have joined hands to bolster the cybersecurity of Internet-of-Things (IoT) products. Signed in late January 2024, the Joint Cybersafe Products Action Plan marks a significant step towards fostering technical cooperation and aligning cybersecurity requirements across the Atlantic.

This collaborative effort holds the potential to not only enhance consumer trust in IoT devices but also streamline compliance processes for businesses operating in both regions. The Action Plan specifically targets hardware and software products embedded with IoT capabilities, encompassing a wide range of devices from smart home appliances and wearables to industrial equipment and connected vehicles. The U.S. and EU aim to establish a unified front against cyber threats by recognizing the inherent vulnerabilities associated with these interconnected devices.

This collaborative approach seeks to achieve mutual recognition of their respective cybersecurity labelling programs and regulations, essentially creating a common language for assessing and communicating the security posture of IoT products.

This initiative holds several key benefits for both consumers and businesses. By establishing a harmonized framework for cybersecurity, consumers will gain greater clarity and confidence when purchasing IoT devices. Standardized labelling programs, informed by rigorous testing and certification procedures, will empower consumers to make informed choices based on the level of security offered by each product.

The Action Plan represents a welcome opportunity to streamline compliance processes for businesses operating in the U.S. and EU markets. Currently, navigating the distinct cybersecurity requirements of each region can be a complex and time-consuming endeavour. Mutual recognition of labelling programs would eliminate the need for duplicative testing and certifications, significantly reducing costs and administrative burdens for manufacturers and vendors.

This simplified approach could foster innovation and accelerate the development and deployment of secure IoT solutions, ultimately benefiting both businesses and consumers. The success of the Joint Cybersafe Products Action Plan hinges on the close collaboration between U.S. and EU agencies, including the FCC, the National Institute of Standards and Technology (NIST) in the US, and the European Commission and relevant standardization bodies in the EU.

By prioritizing collaboration and fostering a harmonized approach to cybersecurity, the U.S. and EU are sending a clear message: the safety and security of consumers in the digital age transcends geographical boundaries. This joint effort holds the potential to not only protect individuals and businesses on both sides of the Atlantic but also set a precedent for international cooperation in the ever-evolving digital landscape.