Samsung launches Next-Gen 3D DRAM research lab in Silicon Valley

Samsung’s ambition is to pioneer advancements that will enable larger single-chip capacities exceeding 100 gigabits, setting a new benchmark in the dynamic field of memory chip technology.

Samsung Electronics, the world’s leading memory chip manufacturer, has inaugurated a cutting-edge research lab in the United States dedicated to advancing next-generation three-dimensional (3D) DRAM technology. The newly established lab, operating under Device Solutions America (DSA) in Silicon Valley, is poised to play a pivotal role in Samsung’s pursuit of developing an enhanced DRAM model, positioning the company as a frontrunner in the global 3D memory chip market.

Sources reveal that the lab, under the umbrella of DSA, which oversees Samsung’s semiconductor production in the U.S., is strategically aligned to focus on innovations in 3D DRAM. Samsung’s ambition is to pioneer advancements that will enable larger single-chip capacities exceeding 100 gigabits, setting a new benchmark in the dynamic field of memory chip technology.

In October, Samsung unveiled its plans to introduce new 3D structures for sub-10-nanometer DRAM, a move anticipated to elevate the capacities and performance of memory chips. This initiative reflects Samsung’s commitment to staying at the forefront of technological innovation, particularly in the realm of semiconductor solutions.

Samsung’s foray into 3D memory chip technology dates back to 2013 when it achieved a significant milestone by commercializing 3D vertical NAND flash memory chips, marking an industry-first achievement. This demonstrated Samsung’s pioneering spirit in adopting and advancing emerging technologies, a trait that has consistently positioned the company as an influential player in the semiconductor landscape.

The establishment of the research lab in Silicon Valley signifies Samsung’s recognition of the region’s significance as a hub for technological innovation and collaboration. The strategic location aligns with the company’s broader vision to harness the expertise and ecosystem of Silicon Valley to drive groundbreaking developments in semiconductor technologies.

As the demand for higher capacities and faster speeds in memory solutions continues to rise, Samsung’s focus on next-gen 3D DRAM technology reflects a strategic response to the evolving needs of the market. The research lab’s activities are expected to contribute not only to Samsung’s technological leadership but also to the overall advancement of memory chip capabilities, benefiting a wide range of industries reliant on cutting-edge semiconductor solutions.